Advance Product Information

June 8, 2005

TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com

8

TGF2021-01

Reflow process assembly notes:

•

Use AuSn (80/20) solder with limited exposure to temperatures at or above 300

°C for 30 sec

•

An alloy station or conveyor furnace with reducing atmosphere should be used.

•

Do not use flux

•

Coefficient of thermal expansion matching is critical for long-term reliability.

•

Devices must be stored in a dry nitrogen atmosphere.

Component placement and adhesive attachment assembly notes:

•

Vacuum pencils and/or vacuum collets are the preferred method of pick up.

•

Air bridges must be avoided during placement.

•

The force impact is critical during auto placement.

•

Organic attachment can be used in low-power applications.

•

Curing should be done in a convection oven; proper exhaust is a safety concern.

•

Microwave or radiant curing should not be used because of differential heating.

•

Coefficient of thermal expansion matching is critical.

Interconnect process assembly notes:

•

Thermosonic ball bonding is the preferred interconnect technique.

•

Force, time, and ultrasonics are critical parameters.

•

Aluminum wire should not be used.

•

Devices with small pad sizes should be bonded with 0.0007-inch wire.

•

Maximum stage temperature is 200

°C.

Assembly Process Notes