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TGF2021-01 Datasheet(PDF) 8 Page - TriQuint Semiconductor |
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TGF2021-01 Datasheet(HTML) 8 Page - TriQuint Semiconductor |
8 / 8 page Advance Product Information June 8, 2005 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com 8 TGF2021-01 Reflow process assembly notes: • Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 °C for 30 sec • An alloy station or conveyor furnace with reducing atmosphere should be used. • Do not use flux • Coefficient of thermal expansion matching is critical for long-term reliability. • Devices must be stored in a dry nitrogen atmosphere. Component placement and adhesive attachment assembly notes: • Vacuum pencils and/or vacuum collets are the preferred method of pick up. • Air bridges must be avoided during placement. • The force impact is critical during auto placement. • Organic attachment can be used in low-power applications. • Curing should be done in a convection oven; proper exhaust is a safety concern. • Microwave or radiant curing should not be used because of differential heating. • Coefficient of thermal expansion matching is critical. Interconnect process assembly notes: • Thermosonic ball bonding is the preferred interconnect technique. • Force, time, and ultrasonics are critical parameters. • Aluminum wire should not be used. • Devices with small pad sizes should be bonded with 0.0007-inch wire. • Maximum stage temperature is 200 °C. Assembly Process Notes |
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Similar Description - TGF2021-01 |
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