4 / 11 page
CY62126DV30
MoBL
Document #: 38-05230 Rev. *E
Page 4 of 11
AC Test Loads and Waveforms[8]
Capacitance[7]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz
VCC = VCC(typ)
8
pF
COUT
Output Capacitance
8
pF
Thermal Resistance
Parameter
Description
Test Conditions
TSOP FBGA
Unit
θJA
Thermal Resistance (Junction to Ambient)[7]
Still Air, soldered on a 3 x 4.5 inch,
two-layer printed circuit board
55
76
°C/W
θJC
Thermal Resistance (Junction to Case)[7]
12
11
°C/W
Data Retention Characteristics
Parameter
Description
Conditions
Min.
Typ.[4]
Max.
Unit
VDR
VCC for Data Retention
1.5
V
ICCDR
Data Retention Current
VCC=1.5V, CE > VCC − 0.2V,
VIN > VCC − 0.2V or VIN < 0.2V
L
4
µA
LL
3
tCDR[7]
Chip Deselect to Data
Retention Time
0
ns
tR[9]
Operation Recovery Time
100
µs
Notes:
7. Tested initially and after any design or proces changes that may affect these parameters.
8. Test condition for the 45 ns part is a load capacitance of 30 pF
9. Full device operation requires linear VCC ramp from VDR to VCC(min.) >100 µs.
VCC Typ
VCC
OUTPUT
R2
50 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT
VTH
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
Rise TIme: 1 V/ns
Fall Time: 1 V/ns
Parameters
2.5V
3.0V
Unit
R1
16600
1103
Ohms
R2
15400
1554
Ohms
RTH
8000
645
Ohms
VTH
1.2
1.75
Volts
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
