2

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IRHM7260

IRHM7260

IRHM7260

IRHM7260

IRHM7260

Pre-Irradiation

Pre-Irradiation

Pre-Irradiation

Pre-Irradiation

Pre-Irradiation

Note: Corresponding Spice and Saber models are available on the G&S Website.

Note: Corresponding Spice and Saber models are available on the G&S Website.

Note: Corresponding Spice and Saber models are available on the G&S Website.

Note: Corresponding Spice and Saber models are available on the G&S Website.

Note: Corresponding Spice and Saber models are available on the G&S Website.

For footnotes refer to the last page

Source-Drain Diode Ratings and Characteristics

Source-Drain Diode Ratings and Characteristics

Source-Drain Diode Ratings and Characteristics

Source-Drain Diode Ratings and Characteristics

Source-Drain Diode Ratings and Characteristics

Parameter

Parameter

Parameter

Parameter

Parameter

Min

Min

Min

Min

Min Typ

Typ

Typ

Typ

Typ Max

Max

Max

Max

Max Units

Units

Units

Units

Units

Test Conditions

Test Conditions

Test Conditions

Test Conditions

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

35*

ISM

Pulse Source Current (Body Diode) ➀

—

—

140

VSD Diode Forward Voltage

—

—

1.8

V

trr

Reverse Recovery Time

—

—

820

nS

Tj = 25°C, IF = 35A, di/dt ≤ 100A/µs

QRR Reverse Recovery Charge

—

—

8.5

µC

VDD ≤ 50V ➃

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

A

Thermal Resistance

Thermal Resistance

Thermal Resistance

Thermal Resistance

Thermal Resistance

Parameter

Parameter

Parameter

Parameter

Parameter

Min

Min

Min

Min

Min Typ

Typ

Typ

Typ

Typ Max

Max

Max

Max

Max Units

Units

Units

Units

Units

Test Conditions

Test Conditions

Test Conditions

Test Conditions

Test Conditions

RthJC

Junction-to-Case

—

—

0.50

RthJA

Junction-to-Ambient

—

—

48

°C/W

Typical socket mount

RthCS

Case-to-Sink

— 0.21

—

Electrical Characteristics

Electrical Characteristics

Electrical Characteristics

Electrical Characteristics

@ Tj = 25°C (Unless Otherwise Specified)

@ Tj = 25°C (Unless Otherwise Specified)

@ Tj = 25°C (Unless Otherwise Specified)

@ Tj = 25°C (Unless Otherwise Specified)

Parameter

Parameter

Parameter

Parameter

Parameter

Min

Min

Min

Min

Min

Typ

Typ

Typ

Typ

Typ Max

Max

Max

Max

Max Units

Units

Units

Units

Units

Test Conditions

Test Conditions

Test Conditions

Test Conditions

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

200

—

—

V

VGS = 0V, ID = 1.0mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown —

0.26—

V/°C

Reference to 25°C, ID = 1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

—

—

0.070

Ω

VGS = 12V, ID =25A

Resistance

—

—

0.077

VGS = 12V, ID = 35A

VGS(th)

Gate Threshold Voltage

2.0

—

4.0

V

VDS = VGS, ID = 1.0mA

gfs

Forward Transconductance

9.0

—

—

S ( )VDS > 15V, IDS = 25A ➃

IDSS

Zero Gate Voltage Drain Current

—

—

25

VDS= 160V ,VGS=0V

—

—

250

VDS = 160V,

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

100

VGS = 20V

IGSS

Gate-to-Source Leakage Reverse

—

—

-100

VGS = -20V

Qg

Total Gate Charge

—

—

290

VGS =12V, ID =35A

Qgs

Gate-to-Source Charge

—

—

42

nC

VDS = 100V

Qgd

Gate-to-Drain (‘Miller’) Charge

—

—

120

Turn-On Delay Time

—

—

50

VDD = 100V, ID =35A

tr

Rise Time

—

—

200

VGS =12V, RG = 2.35Ω

Turn-Off Delay Time

—

—

200

tf

Fall Time

—

—

130

LS + LD

Total Inductance

—

6.8

—

Measured from Drain Lead (6mm/ 0.25in. from

package) to source lead (6mm/0.25in from

package) with Source wires bonded from Source

Pin to Drain Pad

Ciss

Input Capacitance

—

5300

—

VGS = 0V, VDS = 25V

Coss

Output Capacitance

—

1200

—

pF

f = 1.0MHz

Crss

Reverse Transfer Capacitance

—

360

—

nA

➃

nH

ns

µA

*Current limited by pin diameter