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AX431BM Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers |
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AX431BM Datasheet(HTML) 7 Page - List of Unclassifed Manufacturers |
7 / 7 page Page No. : 7/7 AVANTICS - AX431 Series Specification No.: 050308-FE0001 Soldering Methods for AVANTICS’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface-mount devices Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (T L to TP)<3 oC/sec <3oC/sec Preheat - Temperature Min (Ts min) - Temperature Max (Ts max) - Time (min to max) (ts) 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec Tsmax to T L - Ramp-up Rate <3oC/sec <3oC/sec Time maintained above: - Temperature (T L) - Time (t L) 183oC 60~150 sec 217oC 60~150 sec Peak Temperature (T P) 240oC +0/-5oC 260oC +0/-5oC Time within 5oC of actual Peak Temperature (t P) 10~30 sec 20~40 sec Ramp-down Rate <6oC/sec <6oC/sec Time 25oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245oC ±5oC 5sec ±1sec Pb-Free devices. 260oC +0/-5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP 25 t 25oC to Peak Time |
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