f=1.0MHz

f=1.0MHz

ABSOLUTE MAXIMUM RATINGS

1

2

3

4

Drain-Source Leakage Current

Gate-Source Threshold Voltage

Drain-Source On Resistance

Drain-Source On Resistance

Forward Transconductance

Forward On Voltage

Reverse Recovery Time

Reverse Recovery Charge

Drain-Source Breakdown Voltage

Gate-Source Leakage Current

N-Channel (Q2,Q3)

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

P-CHANNEL (Q1,Q3,Q5)

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

BODY DIODE

7.9mJ

7.9mJ

+175°C MAX

-55°C to +150°C

-55°C to +125°C

300°C MAX

Single Pulse Avalanche Energy

(Q2,Q4,Q6)

(Q1,Q3,Q5)

Junction Temperature

Storage Temperature

Case Operating Temperature Range

Lead Temperature Range

(10 Seconds)

Drain to Source Voltage

Drain to Gate Voltage

Gate to Source Voltage

(Continuous)

Continuous Current

Pulsed Current

Thermal Resistance

(Junction to Case)

100V MAX

100V MAX

±20V MAX

10A MAX

25A MAX

7.9°C/W

Parameter

Units

MSK3014

Test Conditions

V

µA

µA

nA

V

V

Ω

Ω

Ω

Ω

S

S

nC

nC

nC

nS

nS

nS

nS

pF

pF

pF

nC

nC

nC

nS

nS

nS

nS

pF

pF

pF

V

V

nS

nS

µC

µC

Min.

100

-

-

-

2.0

2.0

-

-

-

-

6.4

3.2

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Typ.

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

6.4

27

37

25

640

160

88

-

-

-

15

58

45

46

760

260

170

1.3

-1.6

130

130

650

650

Max.

-

25

-25

±100

4.0

4.0

0.20

0.28

0.11

0.20

-

-

44

6.2

21

-

-

-

-

-

-

-

58

8.3

32

-

-

-

-

-

-

-

-

-

190

190

970

970

ELECTRICAL SPECIFICATIONS

2

1

3

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

1

NOTES:

This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.

Resistance as seen at package pins.

Resistance for die only; use for thermal calculations.

4

Rev. B 7/00

2