800MHz to 1000MHz Variable-Gain

Amplifier with Analog Gain Control

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9

Pin Description

PIN

NAME

FUNCTION

1, 3, 4, 6, 7,

9, 10, 12, 14,

18, 19,

21–24, 27,

28, 30, 31,

33, 34, 36

GND

Ground. Connect to the board’s ground plane using low-inductance layout techniques.

2

OUT_A

Second-Attenuator Output. Internally matched to 50

Ω over the operating frequency band. Connect to

IN through a DC-blocking capacitor if greater than 22dB of gain-control range is required. No

connection is required if the second attenuator is not used.

5, 13, 16, 25,

32

Power Supply. Bypass each pin to GND with capacitors as shown in the Typical Application Circuit.

Place capacitors as close to the pin as possible.

8

IN_A

Second-Attenuator Input. Internally matched to 50

Ω over the operating frequency band. Connect to a

50

Ω RF source through a DC-blocking capacitor if greater than 22dB of gain-control range is

required. No connection is required if the second attenuator is not used.

11

present to ensure device reliability.

15

First-Stage Amplifier Bias-Current Setting. Connect to GND through a 1.2k

Ω resistor.

17

Second-Stage Amplifier Bias-Current Setting. Connect to GND through a 3.92k

Ω resistor.

20

OUT

RF Output. Internally matched to 50

Ω over the operating frequency band. Requires a DC-blocking

capacitor.

26

AMP_IN

Amplifier Input. Internally matched to 50

Ω over the operating frequency band. Connect to ATTN_OUT

through a DC-blocking capacitor.

29

ATTN_OUT

Attenuator Output. Internally matched to 50

Ω over the operating frequency band. Connect to AMP_IN

through a DC-blocking capacitor.

35

IN

RF Input. Internally matched to 50

Ω over the operating frequency band. Connect to a 50Ω RF source

through a DC-blocking capacitor if the second attenuator is not used.

Exposed

Paddle

GND

Exposed Paddle Ground Plane. This paddle affects RF performance and provides heat dissipation.

This paddle MUST be soldered evenly to the board’s ground plane for proper operation.