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LMX321AXK Datasheet(PDF) 4 Page - Maxim Integrated Products |
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LMX321AXK Datasheet(HTML) 4 Page - Maxim Integrated Products |
4 / 5 page V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl (Executive Director) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135 °C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( λ) is calculated as follows: λ = 1 = 1.83 (Chi square value for MTTF upper limit) MTTF 192 x 4389 x 79 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV λ = 13.76 x 10-9 λ = 13.76 F.I.T. (60% confidence level @ 25°C) This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5662) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1L). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85 °C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The OX63 die type has been found to have all pins able to withstand a transient pulse of ±25000V, per Mil- Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of ±250mA. |
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