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P

(3.3 * 2.5) V x 1 A + 800 mW

(7)

RθJAmax + (125 * 55)°C 800 mW + 87.5°C W

(8)

0

100

120

140

160

180

No Air Flow

80

60

40

20

0.1

1

10

0

1

2

3

6

0

25

50

75

100

150

125

4

5

TPS726126

TPS72615, TPS72616

TPS72618, TPS72625

SLVS403F – MAY 2002 – REVISED MAY 2005

THERMAL INFORMATION (continued)

mW. The operating environment used to construct Figure 23 consisted of a board with 1 oz. copper planes. The

package is soldered to a 1 oz. copper pad on the top of the board. The pad is tied through thermal vias to the 1

oz. ground plane.

Figure 23. SOT223 Thermal Resistance vs PCB AREA

plane area and a specific ambient temperature can be computed (as shown in Figure 24).

Figure 24. SOT223 Power Dissipation

11