MSB92ASWT1

http://onsemi.com

3

150

°C - 25°C

0.625

°C/W

= 200 milliwatts

260

°C for more than 10 seconds.

mum temperature gradient should be 5

°C or less.

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and re-

sult in latent failure due to mechanical stress.

ing cooling.

* Soldering a device without preheating can cause exces-

sive thermal shock and stress which can result in damage

to the device.

INFORMATION FOR USING THE SC-70/SOT-323 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

SC-70/SOT-323 POWER DISSIPATION

The power dissipation of the SC-70/SOT-323 is a func-

tion of the pad size. This can vary from the minimum pad

size for soldering to the pad size given for maximum power

dissipation. Power dissipation for a surface mount device

perature of the die, R

device junction to ambient; and the operating temperature,

calculated as follows.

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

can calculate the power dissipation of the device which in

this case is 200 milliwatts.

The 0.625

°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve

a power dissipation of 200 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

board such as Thermal Clad

™. Using a board material such

as Thermal Clad, a higher power dissipation of 300 milli-

watts can be achieved using the same footprint.

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are sub-

jected.

ing should be 100

°C or less.*

leads and the case must not exceed the maximum tem-

perature ratings as shown on the data sheet. When us-

ing infrared heating with the reflow soldering method,

the difference should be a maximum of 10

°C.

mm

inches

0.039

1.0

0.094

0.8

2.4

0.031

0.95

0.037

0.95

0.037