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MAX6023EBT12-T Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX6023EBT12-T Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 13 page Precision, Low-Power, Low-Dropout, UCSP Voltage Reference 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS–MAX6023EBT12 (VOUT = 1.250V) (VIN = +5V, IOUT = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. (Voltages Referenced to GND) IN .........................................................................-0.3V to +13.5V OUT .............................................................-0.3V to (VIN + 0.3V) Output Short Circuit to GND or IN (VIN < 6V) ............Continuous Output Short Circuit to GND or IN (VIN ≥ 6V) .........................60s Continuous Power Dissipation (TA = +70°C) 5-Bump UCSP (derate 3.4mW/°C above +70°C)........273mW Operating Temperature Range ..........................-40°C to +85°C Storage Temperature Range .............................-65°C to +150°C Bump Temperature (soldering, 10s)................................+300°C PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS OUTPUT Output Voltage VOUT TA = +25°C 1.247 1.250 1.253 V Initial Voltage Accuracy TA = +25°C -0.24 +0.24 % Output Voltage Temperature Coefficient (Note 3) 10 30 ppm/°C Line Regulation ∆VOUT/ ∆VIN 2.5V ≤ VIN ≤ 12.6V 10 80 µV/V 0 ≤ IOUT ≤ 400µA 0.4 1.0 Load Regulation ∆VOUT/ ∆IOUT -400µA ≤ IOUT ≤ 0 0.5 1.1 µV/µA Short to GND 4 Short-Circuit Current ISC Short to IN 10 mA Temperature Hysteresis (Note 4) 90 ppm Long-Term Stability ∆VOUT/ time 1000hr at TA = +25°C30 ppm/ 1000hr DYNAMIC CHARACTERISTICS f = 0.1Hz to 10Hz 25 µVp-p Noise Voltage eOUT f = 10Hz to 10kHz 65 µVRMS Ripple Rejection ∆VOUT/ ∆IOUT VIN = +5V ±100mV, f = 120Hz 86 dB Turn-On Settling Time tR To VOUT within 0.1% of final value, COUT = 50pF 30 µs Capacitive-Load Stability Range COUT (Note 3) 0 2.2 nF INPUT Supply-Voltage Range VIN Guaranteed by line-regulation test 2.5 12.6 V Supply Current IIN 27 35 µA Change in Supply Current ∆IIN/∆VIN 2.5V ≤ VIN ≤ 12.6V 0.8 2.0 µA/V Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. |
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