MAX6023EBT12-T datasheet(2/13 Pages) MAXIM

Part #	MAX6023EBT12-T

Description	Precision, Low-Power, Low-Dropout, UCSP Voltage Reference

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Manufacturer	MAXIM [Maxim Integrated Products]

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Precision, Low-Power, Low-Dropout, UCSP

Voltage Reference

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS–MAX6023EBT12 (VOUT = 1.250V)

(VIN = +5V, IOUT = 0, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(Voltages Referenced to GND)

IN .........................................................................-0.3V to +13.5V

OUT .............................................................-0.3V to (VIN + 0.3V)

Output Short Circuit to GND or IN (VIN < 6V) ............Continuous

Output Short Circuit to GND or IN (VIN

≥ 6V) .........................60s

Continuous Power Dissipation (TA = +70°C)

5-Bump UCSP (derate 3.4mW/°C above +70°C)........273mW

Operating Temperature Range ..........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Bump Temperature (soldering, 10s)................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

OUTPUT

Output Voltage

VOUT

TA = +25°C

1.247

1.250

1.253

V

Initial Voltage Accuracy

TA = +25°C

-0.24

+0.24

%

Output Voltage Temperature

Coefficient

(Note 3)

10

30

ppm/°C

Line Regulation

∆VOUT/

∆VIN

2.5V

≤ VIN ≤ 12.6V

10

80

µV/V

0

≤ IOUT ≤ 400µA

0.4

1.0

Load Regulation

∆VOUT/

∆IOUT

-400µA

≤ IOUT ≤ 0

0.5

1.1

µV/µA

Short to GND

4

Short-Circuit Current

ISC

Short to IN

10

mA

Temperature Hysteresis

(Note 4)

90

ppm

Long-Term Stability

∆VOUT/

time

1000hr at TA = +25°C30

ppm/

1000hr

DYNAMIC CHARACTERISTICS

f = 0.1Hz to 10Hz

25

µVp-p

Noise Voltage

eOUT

f = 10Hz to 10kHz

65

µVRMS

Ripple Rejection

∆VOUT/

∆IOUT

VIN = +5V ±100mV, f = 120Hz

86

dB

Turn-On Settling Time

tR

To VOUT within 0.1% of final value,

COUT = 50pF

30

µs

Capacitive-Load Stability Range

COUT

(Note 3)

0

2.2

nF

INPUT

Supply-Voltage Range

VIN

Guaranteed by line-regulation test

2.5

12.6

V

Supply Current

IIN

27

35

µA

Change in Supply Current

∆IIN/∆VIN

2.5V

≤ VIN ≤ 12.6V

0.8

2.0

µA/V

Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not allowed.

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