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M366S3323CT0-C1L Datasheet(PDF) 2 Page - Samsung semiconductor

Part # M366S3323CT0-C1L
Description  PC100 Unbuffered DIMM
Download  7 Pages
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Manufacturer  SAMSUNG [Samsung semiconductor]
Direct Link  http://www.samsung.com/Products/Semiconductor
Logo SAMSUNG - Samsung semiconductor

M366S3323CT0-C1L Datasheet(HTML) 2 Page - Samsung semiconductor

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SERIAL PRESENCE DETECT
PC100 Unbuffered DIMM
Rev 0.1 Apr. 2000
M366S1724CT0-C1H/C1L
Byte #
Function Described
Function Supported
Hex value
Note
-1H
-1L
-1H
-1L
0
# of bytes written into serial memory at module manufacturer
128bytes
80h
1
Total # of bytes of SPD memory device
256bytes (2K-bit)
08h
2
Fundamental memory type
SDRAM
04h
3
# of row address on this assembly
12
0Ch
1
4
# of column address on this assembly
9
09h
1
5
# of module
Rows on this assembly
2
Rows
02h
6
Data width of this assembly
64 bits
40h
7
...... Data width of this assembly
-
00h
8
Voltage interface standard of this assembly
LVTTL
01h
9
SDRAM cycle time @CAS latency of 3
10ns
10ns
A0h
A0h
2
10
SDRAM access time from clock @CAS latency of 3
6ns
6ns
60h
60h
2
11
DIMM configuration type
Non parity
00h
12
Refresh rate & type
15.625us, support self refresh
80h
13
Primary SDRAM width
x16
10h
14
Error checking SDRAM width
None
00h
15
Minimum clock delay for back-to-back random column address
tCCD = 1CLK
01h
16
SDRAM device attributes : Burst lengths supported
1, 2, 4, 8 & full page
8Fh
17
SDRAM device attributes : # of
banks on SDRAM device
4
banks
04h
18
SDRAM device attributes : CAS latency
2 & 3
06h
19
SDRAM device attributes : CS latency
0 CLK
01h
20
SDRAM device attributes : Write latency
0 CLK
01h
21
SDRAM module attributes
Non-buffered, non-registered
& redundant addressing
00h
22
SDRAM device attributes : General
+/- 10% voltage tolerance,
Burst Read Single bit Write
precharge all, auto precharge
0Eh
23
SDRAM cycle time @CAS latency of 2
10ns
12ns
A0h
C0h
2
24
SDRAM access time from clock @CAS latency of 2
6ns
7ns
60h
70h
2
25
SDRAM cycle time @CAS latency of 1
-
-
00h
00h
26
SDRAM access time from clock @CAS latency of 1
-
-
00h
00h
27
Minimum row precharge time (=tRP)
20ns
20ns
14h
14h
28
Minimum row active to row active delay (tRRD)
20ns
20ns
14h
14h
29
Minimum RAS to CAS delay (=tRCD)
20ns
20ns
14h
14h
30
Minimum activate precharge time (=tRAS)
50ns
50ns
32h
32h
31
Module
Row density
2
Rows of 64MB
10h
32
Command and address signal input setup time
2ns
2ns
20h
20h
33
Command and address signal input hold time
1ns
1ns
10h
10h
34
Data signal input setup time
2ns
2ns
20h
20h
• Organization : 16Mx64
• Composition : 8Mx16 *8
• Used component part # : K4S281632C-TC1H/C1L
• # of rows in module : 2 Rows
• # of banks in component : 4 banks
• Feature : 1,375mil height & double sided component
• Refresh : 4K/64ms
• Contents ;


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