MAX8863TEUK datasheet(3/8 Pages) MAXIM

Part #	MAX8863TEUK

Description	PLASTIC ENCAPSULATED DEVICES

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Manufacturer	MAXIM [Maxim Integrated Products]

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II. Manufacturing Information

A. Description/Function:

Low-Dropout, 120mA Linear Regulators

B. Process:

S12 (Standard 1.2 micron silicon gate CMOS)

C. Number of Device Transistors:

148

D. Fabrication Location:

California, USA

E. Assembly Location:

Philippines, Thailand or Malaysia

F. Date of Initial Production:

October, 1997

III. Packaging Information

A. Package Type:

5-Pin SOT23

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-filled Epoxy

E. Bondwire:

Gold (1 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

# 05-1701-0281

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-112:

Level 1

IV. Die Information

A. Dimensions:

38 x 55 mils

B. Passivation:

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

C. Interconnect:

Aluminum/Si (Si = 1%)

D. Backside Metallization:

None

E. Minimum Metal Width:

1.2 microns (as drawn)

F. Minimum Metal Spacing:

1.2 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO2

I. Die Separation Method:

Wafer Saw

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