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MAS9275B3TG00 Datasheet(PDF) 2 Page - Micro Analog systems |
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MAS9275B3TG00 Datasheet(HTML) 2 Page - Micro Analog systems |
2 / 10 page DA9275.007 19 February 2004 2 (10) PIN DESCRIPTION Pin Description Symbol x-coordinate y-coordinate Note Crystal/Varactor Oscillator Input X1 209 161 Voltage Control Input VC 425 165 Power Supply Ground VSS 600 175 Buffer Output OUT 1029 1030 Power Supply Voltage VDD 841 1016 Tri State PD 379 1028 Crystal Oscillator Output X2 197 1030 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Min Max Unit Note Supply Voltage VDD - VSS -0.3 6.0 V Input Pin Voltage VSS -0.3 VDD + 0.3 V Power Dissipation PMAX 100 mW Storage Temperature TST -55 120 oC ESD Rating HBM 2 kV RECOMMENDED OPERATION CONDITIONS Parameter Symbol Conditions Min Typ Max Unit Note Supply Voltage VDD 2.5 2.8 5.5 V 1) Supply Current IDD VDD = 2.8 V 2.3 mA Operating Temperature TOP -40 +85 oC Voltage Control Line Impedance VcIMP MAS9275A, MAS9275B 1 MΩ Crystal Pulling Sensitivity S 30 ppm/pF Crystal Load Capacitance CL VC = 1.65 V MAS9275A1 MAS9275B2 MAS9275B3 MAS9275C2 MAS9275C3 MAS9275C4 8 10 10.5 10 10.5 10.5 pF 2) 2) 2) Note 1: It is recommend to connect a 1 nF capacitor to the VDD pin (either in a module or in an end application). Note 2: Crystal Load Capacitance is typically 8.2 pF, when VC = 2.5 V. |
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