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G930T61B Datasheet(PDF) 2 Page - Global Mixed-mode Technology Inc |
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G930T61B Datasheet(HTML) 2 Page - Global Mixed-mode Technology Inc |
2 / 8 page Ver: 4.5 May 13, 2002 TEL: 886-3-5788833 http://www.gmt.com.tw 2 G930/G931 Global Mixed-mode Technology Inc. Absolute Maximum Ratings (Note 1) Input Voltage…………………………..……….………10V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature……………....……..150°C Storage Temperature Range…..…..-65°C ≤ TJ ≤+150°C Lead Temperature, Time for Wave Soldering SOT-89 Package……………..………………...260°C, 4s Continuous Power Dissipation (TA = +25°C) SOT89 (1):…………………………………..……..…0.42W Note (1) :See Recommended Minimum Footprint. Operating Conditions (Note 1) Input Voltage……………………………………….4V~7V Temperature Range……………………0°C ≤ TJ ≤125°C Electrical Characteristics VIN =5V, IO = 400mA, CIN = 1µF, COUT =10 µF, All specifications apply for TA = TJ = 25°C. [Note 3] PARAMETER CONDITIONS MIN TYP MAX UNITS Output Voltage 5mA < IO <400mA 3.43 3.5 3.605 V Line Regulation 4V < VIN < 7V, IO = 10mA 22 mV Load Regulation 50mA < IO < 400mA 30 mV Output Impedance 100mA DC and 100mA AC, fo = 120Hz 103 m Ω Quiescent Current VIN = 5V 0.6 mA Ripple Rejection fi = 120Hz, 1VP-P, Io = 100mA 42 dB IO = 400mA 0.8 0.9 V Dropout Voltage IO = 100mA 125 150 mV Short Circuit Current 0.77 A Over Temperature 125 °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal re- sistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient tem- perature is Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 130°C and IC will go into thermal shutdown. For the G930/G931 in SOT 89 package, θJA is 250°C/W. (See Recom- mended Minimum Footprint). The safe operation in SOT 89, it can see “Typical Performance Characteris- tics” (Safe Operating Area). Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as pos- sible. Note4: The type of output capacitor should be tantalum or aluminum. Definitions Dropout Voltage The input/output Voltage differential at which the regu- lator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 100mV below its nominal value, dropout voltage is affected by junction temperature, load cur- rent and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly af- fected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measure- ment is made under conditions of low dissipation or by using pulse techniques such that average chip tem- perature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. |
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