Electronic Components Datasheet Search |
|
NE5511279A-T1A Datasheet(PDF) 1 Page - NEC |
|
NE5511279A-T1A Datasheet(HTML) 1 Page - NEC |
1 / 3 page NEC'S 7.5 V UHF BAND RF POWER SILICON LD-MOS FET FEATURES • HIGH OUTPUT POWER: Pout = 40.0 dBm TYP., f = 900 MHz, VDS = 7.5 V, Pout = 40.5 dBm TYP., f = 460 MHz, VDS = 7.5 V, • HIGH POWER ADDED EFFICIENCY: ηadd = 48% TYP., f = 900 MHz, VDS = 7.5 V, ηadd = 50% TYP., f = 460 MHz, VDS = 7.5 V, • HIGH LINEAR GAIN: GL = 15.0 dB TYP., f = 900 MHz, VDS = 7.5 V, GL = 18.5 dB TYP., f = 460 MHz, VDS = 7.5 V, • SURFACE MOUNT PACKAGE: 5.7 x 5.7 x 1.1 mm MAX • SINGLE SUPPLY: VDS = 2.8 to 8.0 V NE5511279A DESCRIPTION NEC's NE5511279A is an N-Channel silicon power laterally diffused MOSFET specially designed as the transmission power amplifier for 7.5 V radio systems. Die are manu- factured using NEC's NEWMOS1 technology and housed in a surface mount package. This device can deliver 40.0 dBm output power with 48% power added efficiency at 900 MHz using a 7.5 V supply voltage. • UHF RADIO SYSTEMS • CELLULAR REPEATERS • TWO-WAY RADIOS • FRS/GMRS • FIXED WIRELESS APPLICATIONS California Eastern Laboratories SYMBOL PARAMETER MIN TYP MAX UNIT TEST CONDITIONS Pout Output Power 38.5 40.0 − dBm f = 900 MHz, VDS = 7.5 V, ID Drain Current − 2.5 − APin = 27 dBm, ηadd Power Added Efficiency 42 48 − % IDSQ = 400 mA (RF OFF) GL Linear Gain − 15.0 − dB Pin = 5 dBm Pout Output Power − 40.5 − dBm f = 460 MHz, VDS = 7.5 V, ID Drain Current − 2.75 − APin = 25 dBm, ηadd Power Added Efficiency − 50 − % IDSQ = 400 mA (RF OFF) GL Linear Gain − 18.5 − dB Pin = 5 dBm IGSS Gate to Source Leak Current −− 100 nA VGS = 6.0 V IDSS Drain to Source Leakage Current (Zero Gate Voltage Drain Current) −− 100 nA VDS = 8.5 V Vth Gate Threshold Voltage 1.0 1.5 2.0 V VDS = 4.8 V, IDS = 1.5 mA Rth Thermal Resistance − 5 − °C/W Channel to Case gm Transconductance − 2.3 − SVDS = 3.5 V, IDS = 900 mA BVDSS Drain to Source Breakdown Voltage 20 24 − VIDSS = 15 µA ELECTRICAL CHARACTERISTICS (TA = 25°C) Notes: DC performance is 100% tested. RF performance is tested on several samples per wafer. Wafer rejection criteria for standard devices is 1 reject for several samples. OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE 79A (Bottom View) 3.6±0.2 1.5±0.2 0.8 MAX. Source Gate Drain 0.4±0.15 5.7 MAX. 4.2 MAX. Source Gate Drain |
Similar Part No. - NE5511279A-T1A |
|
Similar Description - NE5511279A-T1A |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |