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MR18R1628EG0-CK8 Datasheet(PDF) 11 Page - Samsung semiconductor |
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MR18R1628EG0-CK8 Datasheet(HTML) 11 Page - Samsung semiconductor |
11 / 16 page Page 10 MR16R1624(8/G)EG0 MR18R1624(8/G)EG0 Version 1.0 May 2004 Figure 3: 256Mb/288Mb base RIMM Module PCB Physical Dimensions Physical Dimensions -1 ( For PCB ) The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate. The dimensions without tolerance specification use the default tolerance of ±0.127[±0.005]. 133.35 ±0.127[5.250±0.005] 45.00[1.772] 1.00[0.039] 5.68[0.2236] 11.50[0.453] 45.00[1.772] 78.175[3.078] 55.175 ±0.08[2.172±0.003] 7.468[0.294] 4.50[0.177] A-1 A-92 DETAIL A DETAIL B B-1 0.80 ±0.10 0.15 ±0.10 2.99 ±0.05 [0.031 ±0.004] [0.006 ±0.004] [0.12 ±0.002] DETAIL A 3.00 ±0.10 2.00 ±0.10 DETAIL B [0.12 ±0.004] [0.079 ±0.004] Min.4.88 [0.192] R 1.00 1.00[0.039] 3.00[0.118] 6.35[0.25] R 2.00 COMPONENT AREA (A SIDE) DIA 2.44 120.65[4.75] COMPONENT AREA (B SIDE) 4.00 ±0.15 [0.157 ±0.006] Note : The gray area above represents the contact surface of the heat spreader. + + Min.6.35[0.25] + Heat spreader B-92 8.60[0.339] 133.35 ±0.127[5.250±0.005] 45.00[1.772] 1.00[0.039] 5.68[0.2236] 11.50[0.453] 45.00[1.772] 78.175[3.078] 55.175 ±0.08[2.172±0.003] 7.468[0.294] 4.50[0.177] A-1 A-92 DETAIL A DETAIL B B-1 0.80 ±0.10 2.99 ±0.05 [0.031 ±0.004] [0.12 ±0.002] DETAIL A 3.00 ±0.10 2.00 ±0.10 DETAIL B [0.12 ±0.004] [0.079 ±0.004] Min.4.88 [0.192] R 1.00 1.00[0.039] 3.00[0.118] 6.35[0.25] R 2.00 COMPONENT AREA (A SIDE) DIA 2.44 120.65[4.75] COMPONENT AREA (B SIDE) 4.00 ±0.15 [0.157 ±0.006] Note : The gray area above represents the contact surface of the heat spreader. + + Min.6.35[0.25] + Heat spreader B-92 8.60[0.339] Min.6.35[0.25] Min.6.35[0.25] |
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