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MP7616 Datasheet(PDF) 4 Page - Exar Corporation |
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MP7616 Datasheet(HTML) 4 Page - Exar Corporation |
4 / 8 page MP7616 4 Rev. 2.00 ELECTRICAL CHARACTERISTICS (CONT’D) NOTES: Specifications are subject to change without notice 1 Full Scale Range (FSR) is 10V for unipolar mode. 2 Guaranteed but not production tested. 3 Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur. 4 Specified values guarantee functionality. Refer to other parameters for accuracy. 5 Linearity error is degraded by 65 µV for every mV of voltage offset at output amplifier. 6 Output leakage current refers to IOUT1. One LSB of current constantly flows into IOUT2 (30nA at 5kΩ input impedance, VREF = +10 V) due to ladder termination into IOUT2. ABSOLUTE MAXIMUM RATINGS (TA = +25 °C unless otherwise noted)1, 2 VDD to GND 0 to +17 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Digital Input Voltage to GND GND –0.5 to VDD +0.5 V . . . . IOUT1, IOUT2 to GND GND –0.5 to VDD +0.5 V . . . . . . . . . . . VREF to GND +25 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VRFB to GND +25 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage Temperature –65 °C to +150°C . . . . . . . . . . . . . . . . . Lead Temperature (Soldering, 10 seconds) +300 °C . . . . . . Package Power Dissipation Rating to 75 °C CDIP, PDIP, SOIC 1000mW . . . . . . . . . . . . . . . . . . . . . . . . Derates above 75 °C 13mW/ °C . . . . . . . . . . . . . . . . . . . . . NOTES: 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. APPLICATION NOTES Refer to Section 8 for Applications Information |
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