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SN74LVC1G98YEAR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC1G98YEAR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 16 page www.ti.com FEATURES In2 3 2 4 6 1 In1 In2 Y GND In0 DBV PACKAGE (TOP VIEW) YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) DCK PACKAGE (TOP VIEW) 3 2 4 6 1 In1 In2 Y GND In0 3 2 4 6 1 In1 Y GND In0 In1 In0 In2 Y GND DRL PACKAGE (TOP VIEW) See mechanical drawings for dimensions. 1 4 2 3 6 VCC VCC VCC 5 VCC 5 5 5 DESCRIPTION/ORDERING INFORMATION SN74LVC1G98 CONFIGURABLE MULTIPLE-FUNCTION GATE SCES417H – DECEMBER 2002 – REVISED JUNE 2005 • Ioff Supports Partial-Power-Down Mode Operation • Available in the Texas Instruments NanoStar™ and NanoFree™ Packages • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • Supports 5-V VCC Operation • ESD Protection Exceeds JESD 22 • Inputs Accept Voltages to 5.5 V – 2000-V Human-Body Model (A114-A) • Max tpd of 6.3 ns at 3.3 V – 200-V Machine Model (A115-A) • Low Power Consumption, 10- µA Max I CC – 1000-V Charged-Device Model (C101) • ±24-mA Output Drive at 3.3 V This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G98 features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VCC or GND. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoStar™ – WCSP (DSBGA) SN74LVC1G98YEAR 0.17-mm Small Bump – YEA NanoFree™ – WCSP (DSBGA) SN74LVC1G98YZAR 0.17-mm Small Bump – YZA (Pb-free) Reel of 3000 _ _ _CW_ NanoStar™ – WCSP (DSBGA) SN74LVC1G98YEPR 0.23-mm Large Bump – YEP NanoFree™ – WCSP (DSBGA) –40°C to 85°C SN74LVC1G98YZPR 0.23-mm Large Bump – YZP (Pb-free) Reel of 3000 SN74LVC1G98DBVR SOT (SOT-23) – DBV C98_ Reel of 250 SN74LVC1G98DBVT Reel of 3000 SN74LVC1G98DCKR SOT (SC-70) – DCK CW_ Reel of 250 SN74LVC1G98DCKT SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G98DRLR CW_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar, NanoFree are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2002–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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