CYStech Electronics Corp.

Spec. No. : C016J3

Issued Date : 2018.04.11

Revised Date : 2018.04.12

Page No. : 9/ 9

MTB010N06RJ3

CYStek Product Specification

TO-252 Dimension

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.087

0.094

2.200

2.400

e

0.086

0.094

2.186

2.386

A1

0.000

0.005

0.000

0.127

e1

0.172

0.188

4.372

4.772

B

0.039

0.048

0.990

1.210

H

0.163 REF

4.140 REF

b

0.026

0.034

0.660

0.860

K

0.190 REF

4.830 REF

b1

0.026

0.034

0.660

0.860

L

0.386

0.409

9.800

10.400

C

0.018

0.023

0.460

0.580

L1

0.114 REF

2.900 REF

C1

0.018

0.023

0.460

0.580

L2

0.055

0.067

1.400

1.700

D

0.256

0.264

6.500

6.700

L3

0.024

0.039

0.600

1.000

D1

0.201

0.215

5.100

5.460

P

0.026 REF

0.650 REF

E

0.236

0.244

6.000

6.200

V

0.211 REF

5.350 REF

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead : Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:

Style: Pin 1.Gate 2.Drain 3.Source

4.Drain

3-Lead TO-252 Plastic Surface Mount Package

CYStek Package Code: J3

Device

Name

Date

Code

B010

N06R

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