CM1205-16CS datasheet(4/7 Pages) CALMIRCO

Part #	CM1205-16CS

Description	ESD Protection Arrays, Chip Scale Package

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Manufacturer	CALMIRCO [California Micro Devices Corp]

Direct Link	http://www.calmicro.com

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4 / 7 page

4

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

L Tel: 408.263.3214

L Fax: 408.263.7846 L www.calmicro.com

11/17/03

CM1205

Application Information

Refer to Application Note AP-217, "The Chip Scale

Package", for a detailed description of Chip Scale

Packages offered by California Micro Devices.

Figure 1. Recommended Non-Solder Mask Defined Pad Illustration

Figure 2. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 3. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

0.300mm

Pad Shape

Round

Pad Definition

Non-Solder Mask defined pads

Solder Mask Opening

0.350mm Round

Solder Stencil Thickness

0.125 - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

0.360mm Round

Solder Flux Ratio

50/50 by volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance — Edge To Corner Ball

+50

µm

Solder Ball Side Coplanarity

+20

µm

Maximum Dwell Time Above Liquidous

60 seconds

Soldering Maximum Temperature

260°C

Solder Mask Opening

0.350mm DIA.

Non-Solder Mask Defined Pad

0.300mm DIA.

Solder Stencil Opening

0.360mm DIA.

200

250

150

100

50

0

1:00.0

2:00.0

3:00.0

4:00.0

Time (minutes)

Similar Part No. - CM1205-16CS

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ON Semiconductor	CM1205-08CP	188Kb / 8P	8-Channel ESD Protection Array in Chip Scale Package April 2010 ??Rev. 3
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CM1205-16CS Datasheet(PDF) 4 Page - California Micro Devices Corp

CM1205-16CS Datasheet(HTML) 4 Page - California Micro Devices Corp

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