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UT8Q512K32 Datasheet(PDF) 4 Page - Aeroflex Circuit Technology |
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UT8Q512K32 Datasheet(HTML) 4 Page - Aeroflex Circuit Technology |
4 / 14 page 4 ABSOLUTE MAXIMUM RATINGS1 (Referenced to V SS) Notes: 1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability and performance. 2. Maximum junction temperature may be increased to +175 °C during burn-in and steady-static life. 3. Test per MIL-STD-883, Method 1012. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS VDD DC supply voltage -0.5 to 4.6V V I/O Voltage on any pin -0.5 to 4.6V TSTG Storage temperature -65 to +150 °C PD Maximum power dissipation 1.0W (per byte) T J Maximum junction temperature2 +150 °C Θ JC Thermal resistance, junction-to-case 3 10 °C/W II DC input current ±10 mA SYMBOL PARAMETER LIMITS VDD Positive supply voltage 3.0 to 3.6V T C Case temperature range -40 to +125 °C VIN DC input voltage 0V to VDD |
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