Rev. B.13 - Mar., 2004

HPL1117

4

 Copyright HIPAC Semiconductor, Inc.

www.hipacsemi.com

Electrical Characteristics (Cont.)

HPL1117

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

(Note2)

1

1.1

Dropout Voltage

(Note2)

(Note2)

1.05

1.1

1.2

1.3

V

Current Limit

°C

1000

mA

Adjust Pin Current

HPL1117

(V

60

120

µA

∆I

ADJ

Adjust Pin Current

Change HPL1117

10mA

≤ I

OUT

≤1A,

1.4V

≤(V

IN

≤10.75V

0.2

5

µA

Minimum Load

Current HPL1117

(Note3)

1.7

mA

PSRR

Ripple Rejection

60

75

dB

Thermal Regulation T

°C, 30ms Pulse

0.01

0.02

%/W

Temperature

Stability

0.5

%

Long -Term Stability T

J

=125

°C,1000Hrs.

0.3

%

RMS Output Noise

°C,10Hz≤F≤10kHz, (% of V

0.003

%

θ

th

Thermal Resistance Junction to Case, at Tab

Junction to Ambient

15

50

°C/ W

OT

Over Temperature

Point

150

°C

Quiescent Current

HPL1117-18

HPL1117-25

HPL1117-28

HPL1117-33

HPL1117-50

5.5

5.5

5.5

5.5

5.5

10

10

10

10

10

mA

Note 1 : See thermal regulation specifications for changes in output voltage due to heating effects. Load line regulations are mea-

sured at a constant junction temperature by low duty cycle pulse testing.

Note 2 : Dropout voltage is specified over the full output current range of the device. Dropout voltage is defined as the minimum input/output

differential measured at the specified output current. Test points and limits are also shown on the Dropout Voltage curve.

Note 3 : Minimum load current is defined as the minimum output current required to maintain regulation.