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AM29DL324GT70 Datasheet(PDF) 3 Page - Advanced Micro Devices |
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AM29DL324GT70 Datasheet(HTML) 3 Page - Advanced Micro Devices |
3 / 58 page This document contains information on a product under development at Advanced Micro Devices. The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice. Publication# 25686 Rev: B Amendment/8 Issue Date: February 9, 2005 Refer to AMD’s Website (www.amd.com) for the latest information. Am29DL32xG 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory DISTINCTIVE CHARACTERISTICS ARCHITECTURAL ADVANTAGES ■ Simultaneous Read/Write operations — Data can be continuously read from one bank while executing erase/program functions in other bank — Zero latency between read and write operations ■ Multiple bank architectures — Three devices available with different bank sizes (refer to Table 3) ■ 256-byte SecSi™ (Secured Silicon) Sector — Factory locked and identifiable: 16 bytes available for secure, random factory Electronic Serial Number; verifiable as factory locked through autoselect function. ExpressFlash option allows entire sector to be available for factory-secured data — Customer lockable: One time programmable. Once locked, data cannot be changed. ■ Zero Power Operation — Sophisticated power management circuits reduce power consumed during inactive periods to nearly zero ■ Package options —63-ball FBGA —48-ball FBGA — 48-pin TSOP — 64-ball Fortified BGA ■ Top or bottom boot block ■ Manufactured on 0.17 µm process technology ■ Compatible with JEDEC standards — Pinout and software compatible with single-power-supply flash standard PERFORMANCE CHARACTERISTICS ■ High performance — Access time as fast 70 ns — Program time: 4 µs/word typical utilizing Accelerate function ■ Ultra low power consumption (typical values) — 2 mA active read current at 1 MHz — 10 mA active read current at 5 MHz — 200 nA in standby or automatic sleep mode ■ Minimum 1 million erase cycles guaranteed per sector ■ 20 year data retention at 125°C — Reliable operation for the life of the system SOFTWARE FEATURES ■ Data Management Software (DMS) — AMD-supplied software manages data programming, enabling EEPROM emulation — Eases historical sector erase flash limitations ■ Supports Common Flash Memory Interface (CFI) ■ Erase Suspend/Erase Resume — Suspends erase operations to allow programming in same bank ■ Data# Polling and Toggle Bits — Provides a software method of detecting the status of program or erase cycles ■ Unlock Bypass Program command — Reduces overall programming time when issuing multiple program command sequences HARDWARE FEATURES ■ Any combination of sectors can be erased ■ Ready/Busy# output (RY/BY#) — Hardware method for detecting program or erase cycle completion ■ Hardware reset pin (RESET#) — Hardware method of resetting the internal state machine to the read mode ■ WP#/ACC input pin — Write protect (WP#) function allows protection of two outermost boot sectors, regardless of sector protect status — Acceleration (ACC) function accelerates program timing ■ Sector protection — Hardware method of locking a sector, either in-system or using programming equipment, to prevent any program or erase operation within that sector — Temporary Sector Unprotect allows changing data in protected sectors in-system For new designs involving TSOP packages, S29JL032H supersedes Am29DL32xG and is the factory recom- mended migration path. Please refer to the S29JL032H Datasheet for specifications and ordering information. For new designs involving Fine-pitch BGA (FBGA) packages, S29PL032J supersedes Am29DL32xG and is the factory-recommended migration path. Please refer to the S29PL032J Datasheet for specifications and ordering information. |
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