3

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T..HFL Series

Bulletin I27107 rev. A 09/97

T

J

Junction operating temp.

-40 to 125

T

stg

Storage temperature range

-40 to 150

R

thJC

Max. internal thermal

resistance junction to case

R

thC-S

Thermal resistance, case

Mounting surface flat, smooth and greased.

to heatsink

Per module

T

Mounting

Base to

1.3 ±10%

Nm

M3.5 mounting screws(2)

torque ±10% heatsink

Non-lubricated threads

Busbar to Terminal

3 ±10%

Nm

M5 screws terminals; non-lubricated threads

wt

Approximate weight

54 (19)

g (oz) See outline table

Case style

D-56

T-MODULE

(2) A mounting compound is recommended and the torque should be rechecked after a period of about 3 hours to allow for the

spread of the compound

(*) Tested on LEM 300A Diodemeter Tester

0.2

K/W

Thermal and Mechanical Specifications

0.85

0.53

0.46

K/W Per module, DC operation

T40HFL

T70HFL

T85HFL

Parameter

Units

Conditions (*)

S02 S05 S10 S02 S05 S10 S02 S05 S10

t

rr

Maximum reverse

T

J

= 25 °C, -di

F

/dt = 100A/

µs

recovery time

I

F

= 1 A to V

R

= 30V

T

J

= 25 °C, -di

F

/dt = 25A/

µs

I

FM

=

π x rated I

F(AV),

V

R

= -30 V

Q

rr

Maximum reverse

T

J

= 25 °C, -di

F

/dt = 100A/

µs

recovered charge

I

F

= 1 A to V

R

= 30V

T

J

= 25 °C, -di

F

/dt = 25A/

µs

I

FM

=

π x rated I

F(AV)

V

R

= -30 V

200

500 1000 200 500 1000 200 500 1000

ns

0.25

0.4

1.35 0.25 0.4 1.35 0.3

0.6

1.6

µC

0.55

2.0

8.0

0.6

2.1

8.5

0.8

3.5

1.5

µC

70

110

270

70

110

270

80

120

290

ns

Reverse Recovery Characteristics

Devices

Units

T40HFL

0.06

0.08

0.10

0.14

0.24

0.05

0.08

0.10

0.15

0.24

K/W

T70HFL

0.05

0.06

0.08

0.11

0.19

0.04

0.06

0.08

0.12

0.19

T85HFL

0.04

0.05

0.06

0.09

0.15

0.03

0.05

0.07

0.09

0.015

∆R Conduction

(The following table shows the increment of thermal resistance R

thJC

when devices operate at different conduction angles than DC)

Parameters

T40HFL T70HFL T85HFL

Units Conditions