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EL2250CS-T7 Datasheet(PDF) 9 Page - Intersil Corporation |
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EL2250CS-T7 Datasheet(HTML) 9 Page - Intersil Corporation |
9 / 15 page 9 FN7061.2 June 7, 2005 Typical Performance Curves (Continued) Supply Current vs Supply Voltage (per amplifier) Supply Current vs Die Temperature (per amplifier) Input Resistance vs Die Temperature Offset Voltage vs Die Temperature (4 Samples) Input Bias Current vs Input Voltage Input Offset Current and Input Bias Current vs Die Temperature Positive Output Voltage Swing vs Die Temperature, RL = 150Ω to GND Negative Output Voltage Swing vs Die Temperature, RL = 150Ω to GND Channel to Channel Isolation vs Frequency Package Power Dissipation vs Ambient Temp. SEMI G42-88 Single Layer Test Board Ambient Temperature (°C) 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 025 50 75 100 125 150 85 1.54W 1.25W PD IP 14 θ JA = 81 °C /W PD IP8 θ JA = 100 °C /W Package Power Dissipation vs Ambient Temp. JEDEC JESD51-3 Low Effective Thermal Conductivity Test Board Ambient Temperature (°C) 1.2 1 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 85 1.042W 781W SO 14 θ JA = 12 0°C /W SO 8 θ JA =1 60° C/W EL2250, EL2450 |
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