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SN65LVDS3487DR Datasheet(PDF) 4 Page - Texas Instruments |
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SN65LVDS3487DR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 33 page SN55LVDS31, SN65LVDS31, SN65LVDS3487, SN65LVDS9638 HIGHSPEED DIFFERENTIAL LINE DRIVERS SLLS261K − JULY 1997 − REVISED MARCH 2004 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 equivalent input and output schematic diagrams 7 V 300 k Ω 50 Ω VCC Input VCC 5 Ω 7 V Y or Z Output EQUIVALENT OF EACH A INPUT EQUIVALENT OF G, G, 1,2EN OR 3,4EN INPUTS TYPICAL OF ALL OUTPUTS 7 V 50 Ω VCC Input 10 k Ω absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) −0.5 V to 4 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Input voltage range, VI −0.5 V to VCC + 0.5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous total power dissipation See Dissipation Rating Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Storage temperature range, Tstg −65 _C to 150°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltages, except differential I/O bus voltages, are with respect to the network ground terminal. DISSIPATION RATING TABLE PACKAGE TA ≤ 25°C POWER RATING DERATING FACTOR‡ ABOVE TA = 25°C TA = 70°C POWER RATING TA = 85°C POWER RATING TA = 125°C POWER RATING D (8) 725 mW 5.8 mW/ °C 464 mW 377 mW — D (16) 950 mW 7.6 mW/ °C 608 mW 494 mW — DGK 425 mW 3.4 mW/ °C 272 mW 221 mW — DGN§ 2.14 W 17.1 mW/ °C 1.37 W 1.11 W — FK 1375 mW 11.0 mW/ °C 880 mW 715 mW 275 mW J 1375 mW 11.0 mW/ °C 880 mW 715 mW 275 mW PW (16) 774 mW 6.2 mW/ °C 496 mW 402 mW — W 1000 mW 8.0 mW/ °C 640 mW 520 mW 200 mW ‡ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. § The PowerPAD must be soldered to a thermal land on the printed-circuit board. See the application note PowerPAD Thermally Enhanced Package (SLMA002) recommended operating conditions MIN NOM MAX UNIT Supply voltage, VCC 3 3.3 3.6 V High-level input voltage, VIH 2 V Low-level input voltage, VIL 0.8 V Operating free-air temperature, TA SN65 prefix −40 85 °C Operating free-air temperature, TA SN55 prefix −55 125 °C |
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