16-Bit, 250Msps, High-Dynamic-Performance,

Dual DAC with LVDS Inputs

2

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ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

REFIO, FSADJ to

OUTIP, OUTIN, OUTQP,

B15P/B15N–B0P/B0N, XORN, XORP, SELIQN,

68-Pin QFN-EP

(derate 41.7mW/°C above +70°C) (Note 1) ............3333.3mW

Thermal Resistance

Operating Temperature Range ......................... -40°C to +85°C

Junction Temperature .................................................... +150°C

Storage Temperature Range ........................... -60°C to +150°C

Lead Temperature (soldering, 10s) ............................... +300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

STATIC PERFORMANCE

Resolution

16

Bits

Integral Nonlinearity

INL

Measured differentially

±3

LSB

Differential Nonlinearity

DNL

Measured differentially

±2

LSB

Offset Error

OS

-0.015

±0.001 +0.015

%FS

Offset-Drift Tempco

±10

ppm/

°C

Full-Scale Gain Error

External reference

-4.1

-0.6

+4.1

%FS

Internal reference

±100

Gain-Drift Tempco

External reference

±50

ppm/

°C

Full-Scale Output Current

(Note 3)

2

20

mA

Output Compliance

Single-ended

-0.5

+1.1

V

Output Resistance

1M

Ω

Output Capacitance

5pF

DYNAMIC PERFORMANCE

Clock Frequency

2

500

MHz

Output Update Rate

1

250

Msps

-164

Noise Spectral Density

-161

dBFS/

Hz

ELECTRICAL CHARACTERISTICS

put load 50

Note 1: Thermal resistors based on a multilayer board with 4 x 4 via array in exposed paddle area.