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MAX9040 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX9040 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 15 page Micropower, Single-Supply, UCSP/SOT23 Comparator + Precision Reference ICs 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS—A Grade (0.4% Initial Accuracy) (VCC = +5V, VEE = 0V, VCM = 0V, IOUT = 0A, IREF = 0A, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Supply Voltage (VCC to VEE) ....................................-0.3V to +6V All Other Pins ...................................(VEE - 0.3V) to (VCC + 0.3V) Output Short-Circuit Duration (OUT_, REF) ...............Indefinite Short Circuit to Either Supply Continuous Power Dissipation (TA = +70°C) 5-Pin SOT23 (derate 7.10mW/°C above +70°C)..........571mW 6-Bump UCSP (derate 3.9mW/°C above +70°C) ........308mW 6-Pin SOT23 (derate 8.70mW/°C above +70°C)..........696mW 8-Pin SO (derate 5.88mW/°C above +70°C)................471mW 8-Pin µMAX (derate 4.1mW/°C above +70°C) .............330mW 10-Pin µMAX (derate 5.6mW/°C above +70°C) ...........444mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Bump Reflow Temperature (Note 1) ................................+235°C Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom- mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection Packaging Reflow. Preheating is required. Hand or wave soldering is not allowed. PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS MAX9040–MAX9043 2.5 5.5 Supply Voltage Range (Note 3) VCC MAX9050–MAX9053 2.7 5.5 V VCC = 2.7V 47 67 MAX9040/MAX9041/ MAX9050/MAX9051 VCC = 5V 52 72 VCC = 2.7V 55 80 Supply Current ICC MAX9042/MAX9043/ MAX9052/MAX9053 VCC = 5V 60 85 µA COMPARATORS TA = +25°C ±0.5 ±5.0 Input Offset Voltage (Note 4) VOS Over entire common-mode range TA = -40°C to +85°C ±7.0 mV Input Hysteresis VHYST ±3.0 mV Input Bias Current (Notes 5, 6, 7) IB Specified common-mode range ±0.001 ±10.0 nA Input Offset Current (Note 5) IOS Specified common-mode range ±0.5 pA TA = +25°C VEE - 0.25 VCC + 0.25 Common-Mode Voltage Range (Notes 5, 8) CMVR TA = -40°C to +85°CVEE VCC V Common-Mode Rejection Ratio (Note 5) CMRR Specified common-mode range 52 80 dB MAX9040–MAX9043, 2.5V ≤ VCC ≤ 5.5V 55 80 Power-Supply Rejection Ratio PSRR MAX9050–MAX9053, 2.5V ≤ VCC ≤ 5.5V 55 80 dB Input Capacitance (Note 5) CIN 2.5 pF VCC = 5V 95 Output Short-Circuit Current ISC VOUT = VEE or VCC VCC = 2.7V 35 mA VCC = 5V, ISINK = 8mA 0.2 0.55 Output Voltage Low VOL VCC = 2.7V, ISINK = 3.5mA 0.15 0.4 V |
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