Part Name
         Description
NTE2933

 MOSFET N-Channel, Enhancement Mode High Speed Switch ( 3 Page)


NTE
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Electrical Characteristics: (TC = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Drain–Source Breakdown Voltage
BVDSS
VGS = 0V, ID = 250µA
400
V
Breakdown Voltage Temperature
Coefficient
∆V(BR)DSS/
∆TJ
ID = 250µA
0.50
V/
°C
Gate Threshold Voltage
VGS(th)
VDS = 5V, ID = 250µA
2.0
4.0
V
Gate–Source Leakage Forward
IGSS
VGS = 30V
100
nA
Gate–Source Leakage Reverse
IGSS
VGS = –30V
–100
nA
Drain–to–Source Leakage Current
IDSS
VDS = 400V
10
µA
VDS = 320V, TC = +150°C
100
µA
Static Drain–Source ON Resistance
RDS(on)
VGS = 10V, ID = 4A, Note 4
0.55
Forward Transconductance
gfs
VDS = 50V, ID = 4A, Note 4
7.05
mhos
Input Capacitance
Ciss
VGS = 0V, VDS = 25V, f = 1MHz
1180
1530
pF
Output Capacitance
Coss
175
205
pF
Reverse Transfer Capacitance
Crss
80
95
pF
Turn–On Delay Time
td(on)
VDD = 200V, ID = 10A, RG = 9.1Ω,
18
50
ns
Rise Time
tr
Note 4, Note 5
21
55
ns
Turn–Off Delay Time
td(off)
78
170
ns
Fall Time
tf
28
65
ns
Total Gate Charge
Qg
VGS = 10V, ID = 10A, VDS = 320V,
58
75
nC
Gate–Source Charge
Qgs
Note 4, Note 5
8.1
nC
Gate–Drain (“Miller”) Charge
Qgd
31.3
nC
Source–Drain Diode Ratings and Characteristics
Continuous Source Current
IS
(Body Diode)
8
A
Pulse Source Current
ISM
(Body Diode) Note 1
44
A
Diode Forward Voltage
VSD
TJ = +25°C, IS = 8A, VGS = 0V, Note 4
1.5
V
Reverse Recovery Time
trr
TJ = +25°C, IF = 10A, diF/dt = 100A/µs,
315
ns
Reverse Recovery Charge
Qrr
Note 4
2.84
µC
Note 1. Repetitive Rating: Pulse width limited by maximum junction temperature.
Note 4. Pulse Test: Pulse Width = 250
µs, Duty Cycle ≤ 2%.
Note 5. Essentially independent of operating temperature.



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