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EL5824 Datasheet(PDF) 10 Page - Intersil Corporation |
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EL5824 Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 11 page 10 will limit the short circuit current to ±200mA if the outputs are directly shorted to the positive or the negative supply. If the output is shorted indefinitely, the power dissipation could easily increase such that the part will be destroyed. Maximum reliability is maintained if the output continuous current never exceeds ±30mA for the buffers and ±60mA for the VCOM amplifier. These limits are set by the design of the internal metal interconnections. The Unused Buffers It is recommended that any unused buffers should have their inputs tied to ground plane. Power Dissipation With the high-output drive capability of the EL5524, EL5624, EL5724, and EL5824, it is possible to exceed the 125°C “absolute-maximum junction temperature” under certain load current conditions. Therefore, it is important to calculate the maximum junction temperature for the application to determine if load conditions need to be modified for the buffer to remain in the safe operating area. The maximum power dissipation allowed in a package is determined according to: where: •TJMAX = Maximum junction temperature •TAMAX = Maximum ambient temperature • θJA = Thermal resistance of the package •PDMAX = Maximum power dissipation in the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the loads, or: when sourcing, and: when sinking. where: • i = 1 to total number of buffers •VS = Total supply voltage of buffer and VCOM •ISMAX = Total quiescent current •VOUTi = Maximum output voltage of the application •VOUT = Maximum output voltage of VCOM •ILOADi = Load current of buffer •ILA = Load current of VCOM If we set the two PDMAX equations equal to each other, we can solve for the RLOAD's to avoid device overheat. The package power dissipation curves provide a convenient way to see if the device will overheat. The maximum safe power dissipation can be found graphically, based on the package type and the ambient temperature. By using the previous equation, it is a simple matter to see if PDMAX exceeds the device's power derating curves. Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended, lead lengths should be as short as possible, and the power supply pins must be well bypassed to reduce the risk of oscillation. For normal single supply operation, where the VS- pin is connected to ground, one 0.1µF ceramic capacitor should be placed from the VS+ pin to ground. A 4.7µF tantalum capacitor should then be connected from the VS+ pin to ground. One 4.7µF capacitor may be used for multiple devices. This same capacitor combination should be placed at each supply pin to ground if split supplies are to be used. Important Note: The metal plane used for heat sinking of the device is electrically connected to the negative supply potential (VS-). If VS- is tied to ground, the thermal pad can be connected to ground. Otherwise, the thermal pad must be isolated from any other power planes. P DMAX T JMAX - TAMAX Θ JA --------------------------------------------- = P DMAX V S I S ΣiV S+ ( [ V OUTi ) I LOADi ] V S+ ( V OUT ) I LA × – + × – × + × = P DMAX V S I S ΣiV ( OUTi [ V S- ) I LOAD i ] V OUT ( V S- ) I LA × – + × – × + × = EL5524, EL5624, EL5724, EL5824 |
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Similar Description - EL5824 |
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