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TFDU5307-TR3 Datasheet(PDF) 10 Page - Vishay Siliconix

Part # TFDU5307-TR3
Description  Fast Low Profile (2.5 mm) Infrared Transceiver Module(MIR, 1.152 Mbit/s) for IrDA Applications
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TFDU5307-TR3 Datasheet(HTML) 10 Page - Vishay Siliconix

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Document Number 82616
Rev. 1.5, 07-Apr-06
TFDU5307
Vishay Semiconductors
Recommended Solder Profile
Solder Profile for Sn/Pb soldering
Lead-Free, Recommended Solder Profile
The lead-frame based transceivers (all types with the
name TFDUxxxx) are lead (Pb)-free and qualified for
lead (Pb)-free and lead - bearing processing.
In case of using a lead-bearing process we recom-
mend a solder profile as shown in figure 4.
For lead (Pb)-free solder paste like Sn-(3.0-4.0)Ag-
(0.5-0.9)Cu, there are two standard reflow profiles:
Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS).
The Ramp-Soak-Spike profile was developed prima-
rily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown
below in figure 5 and figure 6 are VISHAY’s recom-
mende profiles for use with the TFDUxxxx transceiv-
ers for lead (Pb)-free processing.
Figure 3. Recommended Solder Profile for Sn/Pb soldering
19431_1
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0
50
100
150
200
250
300
350
Time/s
2...4 °C/s
2...4 °C/s
10 s max. at 230 °C
120 s...180 s
160 °C max.
240 °C max.
90 s max.
Figure 4. Solder Profile, RSS Recommendation
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
0
50
100
150
200
250
300
350
Time/s
20 s
2 °C...4 °C/s
2 °C...4 °C/s
90 s...120 s
T
≥ 217 °C for 50 s max
Tpeak = 260 °C max.
50 s max.
T
≥ 255 °C for 20 s max
19261


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