iW1780

Rapid Charge™ AC/DC Digital

Quasi-Resonant PWM Controller

Rev. 1.6

Product Summary

© 2015 Dialog Semiconductor

www.dialog-semiconductor.com

5 of 7

18-Dec-2015

6 Physical Dimensions

Compliant to JEDEC Standard MS12F

Controlling dimensions are in inches; millimeter dimensions are for reference only

This product is RoHS compliant and Halide free.

Soldering Temperature Resistance:

[a] Package is IPC/JEDEC Std 020D moisture sensitivity level 1

[b] Package exceeds JEDEC Std No. 22-A111 for solder immersion resistance; package can withstand

10 s immersion < 260˚C

Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall

not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or

protrusion shall not exceed 0.25 mm per side.

The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the

outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but

including any mismatch between the top and bottom of the plastic body.

8-Lead Small Outline (SOIC) Package

COPLANARITY

0.10 (0.004)

8

5

4

1

SEATING

PLANE

A1

E

H

B

D

e

A

A2

C

L

α

h x 45°

Inches

Millimeters

MIN

0.0040

A1

MAX

MIN

MAX

0.010

0.10

0.25

0.053

A

0.069

1.35

1.75

0.014

B

0.019

0.35

0.49

0.007

C

0.010

0.19

0.25

0.189

D

0.197

4.80

5.00

0.150

E

0.157

3.80

4.00

0.050 BSC

e

1.27 BSC

0.228

H

0.244

5.80

6.20

0.10

h

0.020

0.25

0.50

0.016

L

0.049

0.4

1.25

0°

α

8°

0.049

A2

0.059

1.25

1.50

Figure 6.1 : 8-Lead Small Outline (SOIC) Package