2003 Nov 19

5

Philips Semiconductors

Product specification

Avionics LDMOS transistor

BLA1011-10

handbook, full pagewidth

MGU497

C1 C2

C3

C4

C5

C6

C7

C8

C9

C10

C11

C12

C13

C14

C15

60

51.75

51.75

R1

37.5

9.3

6.0

3.2

3.5

13.5

Dimensions in mm.

The components are situated on one side of the Rogers 6006 printed-circuit board (thickness = 0.64 mm;

and serves as a ground plane. Earth connections from the component side to the ground plane are made by through-metallization.

Fig.6 Printed-circuit board for class-AB test circuit.

List of components for class-AB test circuit (see Fig.6)

Notes

1. American Technical Ceramics type 100A or capacitor of same quality.

2. American Technical Ceramics type 200B or capacitor of same quality.

COMPONENT

DESCRIPTION

VALUE

C1

multilayer ceramic chip capacitor; note 1

2.7 pF

C2, C11

multilayer ceramic chip capacitor; note 1

56 pF

C3

tekelec trimmer; type 37293

0.8 to 8 pF

C4

multilayer ceramic chip capacitor; note 1

3.6 pF

C5

multilayer ceramic chip capacitor; note 1

6.2 pF

C6

multilayer ceramic chip capacitor; note 1

2 pF

C7, C13

multilayer ceramic chip capacitor; note 1

62 pF

C8

multilayer ceramic chip capacitor; note 1

11 pF

C9

multilayer ceramic chip capacitor; note 1

1.5 pF

C10

multilayer ceramic chip capacitor; note 1

6.2 pF

C12

multilayer ceramic chip capacitor; note 2

20 nF

C14

electrolytic capacitor

4.7

µF; 50 V

C15

multilayer ceramic chip capacitor; note 1

36 pF

R1

SMD resistor (0805)

22

Ω