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ATWINC15X0 Datasheet(PDF) 38 Page - Microchip Technology

Part # ATWINC15X0
Description  ATWINC15x0-MR210xB IEEE짰 802.11 b/g/n SmartConnect IoT Module
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

ATWINC15X0 Datasheet(HTML) 38 Page - Microchip Technology

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Figure 13-1. Solder Reflow Profile
25oC
Slope: 1~2oC/sec max.
(217oC to peak)
(Peak: 250oC)
Ramp down rate:
Max. 2.5oC/sec.
Time (sec)
40 ~ 70 sec.
60 ~ 120 sec.
Ramp up rate:
Max. 2.5oC/sec.
Preheat:150 ~ 200oC
217oC
Cleaning
The exposed ground paddle helps to self-align the module, avoiding pad misalignment. The use of no
clean solder pastes is recommended. Full drying of no-clean paste fluxes as a result of the reflow process
must be ensured. This may require longer reflow profiles and/or peak temperatures toward the high end
of the process window as recommended by the solder paste vendor. It is believed that uncured flux
residues could lead to corrosion and/or shorting in accelerated testing and possibly the field.
Rework
Rework is to remove the mounted SIP package and replace with a new unit. It is recommended that once
an ATWINC15x0-MR210xB Module has been removed it should never be reused. During the rework
process, the mounted module and PCB are heated partially, and the module is removed. It is
recommended to pay attention to heat-proof the proximity of the mounted parts and junctions and use the
best nozzle for rework that is suited to the module size.
ATWINC15x0
Reflow Profile Information
© 2017 Microchip Technology Inc.
Datasheet
DS70005304B-page 38


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