Specifications and information are subject to change without notice

WJ Communications, Inc

Phone 1-800-WJ1-4401 FAX: 408-577-6621

e-mail: sales@wj.com

Web site: www.wj.com

December 2004

EC1019

InGaP HBT Gain Block

Product Information

EC1019B-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260

qC reflow temperature) and leaded

(maximum 245

qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Land Pattern

Product Marking

The component will be marked with an

“ 1019G” designator with an alphanumeric lot

code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “ Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1A

Value:

Passes between 250 and 500V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating: Level 3 at +260 C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135” ) diameter drill and have a final plated

thru diameter of .25 mm (.010” ).

2. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

3. Mounting screws can be added near the part to fasten

the board to a heatsink. Ensure that the ground /

thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board

in the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material

and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are

in degrees.